Simulation of manufacturing processes with respect to adhesive curing and residual stress development

by T. Aubel - DYNAmore GmbH


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Categories: 2024 and material testing.

Explore the simulation of manufacturing processes, adhesive curing, and residual stress development in this research project. Discover material card structures, including curing, viscoelasticity, plasticity, and damage. Join us for insights and outlooks!